View monthly record counts
| Month | Records |
|---|---|
| 2 | |
| 20 | |
| 0 | |
| 14 | |
| 0 | |
| 0 | |
| 26 |
TE CONNECTIVITY -FIRST SENSOR AG
SupplierGERMANY
Data updated:
Top 3 Export Trade Countries
View all on Tradesparq| # | Country / Region | Records |
|---|---|---|
| 1 | India | 62 |
Top 3 Export HS Codes
View all on Tradesparq| # | HS Code | Description (CN) | Description (EN) | Records |
|---|---|---|---|---|
| 1 | 381800 | 经掺杂用于电子工业的已切片化学元素等 | Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics. form of | 62 |
Top 3 Export Trading Partners
View all on Tradesparq| # | Partner Name | Country / Region | Records |
|---|---|---|---|
| 1 | SPEL SEMICONDUCTOR LIMITED | INDIA | 62 |
Latest Export Trade Record
View more records on Tradesparq| Date | May 30, 2024 | Bill No. | — | ||
|---|---|---|---|---|---|
| Supplier Information | Company Name | TE CONNECTIVITY -FIRST SENSOR AG | Buyer Information | Company Name | SPEL SEMICONDUCTOR LIMITED |
| Address | — | Address | — | ||
| Registration No. | — | Registration No. | 0488015138 | ||
| Phone | — | Phone | — | ||
| — | — | ||||
| Product Information | HS Code | 38180090 | HS Description | 经掺杂用于电子工业的已切片化学元素等Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics. form of | |
| Product Description | IC CHIPS IN THE FORM OF SILICON WAFER(ANNEXURE-III SL NO.047)100% EOU UNIT | Brand | — | ||
| Quantity & Price | Amount | 13,298.86 | Weight | — | |
| Quantity | 37,435 NOS | TEU | — | ||
| Shipment Information | Origin Country | GERMANY | Destination Country | INDIA | |
| Port of Loading | — | Destination Port | — | ||
| Loading Place | — | Transport Mode | UNKNOWN | ||
| Transaction Mode | — | Carrier | — | ||
| Vessel Name | — | Voyage | — | ||
| Container No. | — | Shipping Country | — | ||