View monthly record counts
| Month | Records |
|---|---|
| 5 |
Data updated:
| Month | Records |
|---|---|
| 5 |
| # | Country / Region | Records |
|---|---|---|
| 1 | Malaysia | 5 |
| # | HS Code | Description (CN) | Description (EN) | Records |
|---|---|---|---|---|
| 1 | 903190 | 9031所列仪器、器具及机器的零件及附件 | Parts and accessories, in heading of 90.31 | 3 |
| 2 | 903141 | 制造半导体器件(包括集成电路)时检验半导体晶圆、器件(包括集成电路)或检测光掩模及光栅用的光学仪器及器具 | For inspecting semiconductor wafers or devices (including integrated circuits) or for inspecting photomasks or reticles used in manufacturing semiconductor devices (including integrated circuits) | 2 |
| # | Partner Name | Country / Region | Records |
|---|---|---|---|
| 1 | BESI APAC SDN. BHD. @ GLENMARIE SITE | MALAYSIA | 3 |
| 2 | BESI APAC SDN BHD | MALAYSIA | 2 |
| Date | Sep 16, 2025 | Bill No. | W202025109061673 | ||
|---|---|---|---|---|---|
| Supplier Information | Company Name | ST ENGINEERING UIS | Buyer Information | Company Name | BESI APAC SDN BHD @ GLENMARIE SITE |
| Address | 1 ANG MO KIO ELECTRONICS PARK ROAD WEST WING LOADING BAY (STORE) SINGAPORE | Address | NO 22 & 24, JALAN PEMAJU U1/15, SECTION U1, GLENMARIE HICOM INDUSTR SHAH ALAM, SELANGOR | ||
| Registration No. | — | Registration No. | — | ||
| Phone | — | Phone | — | ||
| — | — | ||||
| Product Information | HS Code | 90319090 | HS Description | 9031所列仪器、器具及机器的零件及附件Parts and accessories, in heading of 90.31 | |
| Product Description | FORCE SENSOR 50N | Brand | — | ||
| Quantity & Price | Amount | 6,186.95 | Weight | — | |
| Quantity | 10 UNT | TEU | — | ||
| Shipment Information | Origin Country | CHINA HONGKONG | Destination Country | MALAYSIA | |
| Port of Loading | HONG KONG | Destination Port | KUALA LUMPUR | ||
| Loading Place | — | Transport Mode | AIR | ||
| Transaction Mode | — | Carrier | — | ||
| Vessel Name | — | Voyage | — | ||
| Container No. | — | Shipping Country | — | ||