View monthly record counts
| Month | Records |
|---|---|
| 1 |
SEMPAC
SupplierLocal name: SEMPAC INC
UNITED STATES
9640 SW SUNSHINE CT., STE. 800 BEAV ERTON, OR 97005 UNITED STATES 0 UNITED STATES
Data updated:
Top 3 Export Trade Countries
View all on Tradesparq| # | Country / Region | Records |
|---|---|---|
| 1 | Brazil | 1 |
Top 3 Export HS Codes
View all on Tradesparq| # | HS Code | Description (CN) | Description (EN) | Records |
|---|---|---|---|---|
| 1 | 854290 | 集成电路的零件 | Parts of electronic integrated circuits, n.e.s. | 1 |
Top 3 Export Trading Partners
View all on Tradesparq| # | Partner Name | Country / Region | Records |
|---|---|---|---|
| 1 | INSTITUTO DE PESQUISAS ELDORADO | BRAZIL | 1 |
Latest Export Trade Record
View more records on Tradesparq| Date | Mar 01, 2024 | Bill No. | — | ||
|---|---|---|---|---|---|
| Supplier Information | Company Name | SEMPAC | Buyer Information | Company Name | INSTITUTO DE PESQUISAS ELDORADO |
| Address | — | Address | — | ||
| Registration No. | — | Registration No. | — | ||
| Phone | — | Phone | — | ||
| — | — | ||||
| Product Information | HS Code | 85429000 | HS Description | 集成电路的零件Parts of electronic integrated circuits, n.e.s. | |
| Product Description | SOIC300-24-OP-01 - CAPSULA SOIC 24L (SMALL OUTLINE INTEGRATEDCIRCUIT), 24 PINOS COM DIMENSAO DE 300MIL, PARTE SUPERIOR ABERTA- SERA UTILIZADO NA MONTAGEM DE CIRCUITO INTEGRADO CONECTADO COMSOLDA DE FIO DE OURO (WIRE BONDING), EM SEGUIDA FECHADO COM ATAMPA DE CERAMICA COM ADESIVO EPOXY. | Brand | — | ||
| Quantity & Price | Amount | 5,465.22 | Weight | 1.32 kg | |
| Quantity | 1.32 KGL | TEU | — | ||
| Shipment Information | Origin Country | UNITED STATES | Destination Country | BRAZIL | |
| Port of Loading | — | Destination Port | AEROPORTO INTERNACIONAL DE VIRACOPOS | ||
| Loading Place | — | Transport Mode | AIR | ||
| Transaction Mode | CPT | Carrier | — | ||
| Vessel Name | — | Voyage | — | ||
| Container No. | — | Shipping Country | — | ||