View monthly record counts
| Month | Records |
|---|---|
| 1 | |
| 1 | |
| 2 | |
| 2 | |
| 1 |
Data updated:
| Month | Records |
|---|---|
| 1 | |
| 1 | |
| 2 | |
| 2 | |
| 1 |
| # | Country / Region | Records |
|---|---|---|
| 1 | Malaysia | 7 |
| # | HS Code | Description (CN) | Description (EN) | Records |
|---|---|---|---|---|
| 1 | 350691 | 橡胶或3901至3913聚合物为基本成分的粘合剂 | Adhesives based on polymers of headings 39.01 to 39.13 or on rubber | 5 |
| 2 | 350610 | 零售包装每件净重≤1kg的胶 | Products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg | 1 |
| 3 | 350699 | 未列名的调制胶及其他调制粘合剂 | Glues, prepared, and other prepared adhesives, n.e.s. | 1 |
| # | Partner Name | Country / Region | Records |
|---|---|---|---|
| 1 | BCM ELECTRONICS CORPORATION | MALAYSIA | 4 |
| 2 | HP MALAYSIA MANUF SDN BHD | — | 3 |
| Date | Feb 27, 2026 | Bill No. | 978309 | ||
|---|---|---|---|---|---|
| Supplier Information | Company Name | ELECTRONIC MATERIALS INC | Buyer Information | Company Name | BCM ELECTRONICS CORPORATION |
| Address | 1814 AIRPORT RD | Address | SDN BHD, PLOT 21 JLN HI-TECH 4 | ||
| Registration No. | — | Registration No. | 273972P | ||
| Phone | — | Phone | — | ||
| — | — | ||||
| Product Information | HS Code | 35069110 | HS Description | 橡胶或3901至3913聚合物为基本成分的粘合剂Adhesives based on polymers of headings 39.01 to 39.13 or on rubber | |
| Product Description | ADHESIVE | Brand | — | ||
| Quantity & Price | Amount | 3,277.70 | Weight | 31.80 kg | |
| Quantity | 31.80 KGM | TEU | — | ||
| Shipment Information | Origin Country | UNITED STATES | Destination Country | MALAYSIA | |
| Port of Loading | — | Destination Port | PENANG | ||
| Loading Place | — | Transport Mode | AIR | ||
| Transaction Mode | — | Carrier | — | ||
| Vessel Name | — | Voyage | — | ||
| Container No. | — | Shipping Country | — | ||