Skip to trade overview

CHIPBOND TECHNOLOGY CORP

Supplier
JAPAN
NO.3, LI HSIN 5 RD.SCIENCE PARK HSINCHU, TAIWAN AK HSIHSINCHU CITY

Data updated:

Total Export Trade Records343Total Export Value18.04MTotal Export Weight1,896.48Export Trading Partners17Export Trade Countries2
Export Trade Trend (Oct 2025 – Sep 2026)2025-10: 31; 2025-11: 40; 2025-12: 17; 2026-01: 43; 2026-02: 14; 2026-03: 17; 2026-04: 22; 2026-05: 25; 2026-06: 28; 2026-07: 39; 2026-08: 42; 2026-09: 25
View monthly record counts
Monthly counts shown in this chart. Not provided means unknown, not zero.
MonthRecords
31
40
17
43
14
17
22
25
28
39
42
25

Top 3 Export HS Codes

View all on Tradesparq
#HS CodeDescription (CN)Description (EN)Records
1854239其他集成电路Electronic integrated circuits (excluding such as processors, controllers, memories and amplifiers)146
2854160已装配的压电晶体Mounted piezoelectric crystals94
3854290集成电路的零件Parts of electronic integrated circuits, n.e.s.80

Latest Export Trade Record

View more records on Tradesparq
All fields from the latest supplied export record. A dash means the field was not provided; zero is a supplied zero.
DateOct 14, 2026Bill No.545716788770
Supplier InformationCompany NameCHIPBOND TECHNOLOGY CORPBuyer InformationCompany NameALLEGRO MICROSYSTEMS PHILS INC
AddressNO 3 LI HSIN 5 RD SBIP HSIN CHU CIT Y HSINCHU CITY TAIWANAddress4756 SAMPAGUITA STREET MARIMAR VILL AGE BRGY SUN VALLEY PARANAQUE CITY 1700 PHILIPPINES
Registration No.—Registration No.000419293000
Phone—Phone—
Email—Email—
Product InformationHS Code85416000HS Description已装配的压电晶体Mounted piezoelectric crystals
Product DescriptionWAFER/DIEBrand—
Quantity & PriceAmount118,074.10Weight7.50 kg
Quantity467,932 PieceTEU—
Shipment InformationOrigin CountryJAPANDestination CountryPHILIPPINES
Port of Loading—Destination PortNINOY AQUINO INTERNATIONAL AIRPORT NAIA
Loading Place—Transport ModeUNKNOWN
Transaction ModeEXWCarrier—
Vessel NameFX5158Voyage—
Container No.—Shipping Country—