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BONDTRONICS TECHNOLOGY INC

Supplier
GERMANY
NO. 200 HOUGANG 1ST RD. XINZHUANG DIST. NEW TAIPEI CITY 24257 TAIWAN TW

Data updated:

Total Export Trade Records1Total Export Value324.54KTotal Export Weight1,570Export Trading Partners1Export Trade Countries1
Export Trade Trend (Feb 2024)2024-02: 1
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MonthRecords
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Top 3 Export HS Codes

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#HS CodeDescription (CN)Description (EN)Records
1848610制造单晶柱或晶圆用的机器及装置Machines and apparatus for the manufacture of boules or wafers1

Latest Export Trade Record

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All fields from the latest supplied export record. A dash means the field was not provided; zero is a supplied zero.
DateMar 04, 2024Bill No.C427898
Supplier InformationCompany NameBONDTRONICS TECHNOLOGY INCBuyer InformationCompany NameNEWEB VIETNAM CO., LTD
AddressNO. 200 HOUGANG 1ST RD. XINZHUANG DIST. NEW TAIPEI CITY 24257 TAIWAN TWAddressLot Cn01 Dong Van Iii Industrial Park Dong Van Ward Duy Tien Town Ha Nam Province Vietnam
Registration No.—Registration No.0700837869
Phone—Phone(886)03.6667799
Email—Email—
Product InformationHS Code84861090HS Description制造单晶柱或晶圆用的机器及装置Machines and apparatus for the manufacture of boules or wafers
Product DescriptionMM-P99223002781#&Automatic wafer component mounting equipment, used to produce semiconductor wafers model: T-6000-L/G Die Bonder, Tresky brand, voltage 100-253 VAC, year of production 2024, new 100%Brand—
Quantity & PriceAmountEUR 324,539.30Weight1,570 kg
Quantity1 PiecesTEU—
Shipment InformationOrigin CountryGERMANYDestination CountryVIETNAM
Port of LoadingDEBERDestination PortVNHAN
Loading Place—Transport ModeAIR
Transaction ModeCIPCarrier—
Vessel NameLH8020 02MARVoyage—
Container No.—Shipping Country—