View monthly record counts
| Month | Records |
|---|---|
| 4 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 1 |
Data updated:
| Month | Records |
|---|---|
| 4 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 0 | |
| 1 |
| # | Country / Region | Records |
|---|---|---|
| 1 | India | 4 |
| 2 | Malaysia | 1 |
| # | HS Code | Description (CN) | Description (EN) | Records |
|---|---|---|---|---|
| 1 | 381800 | 经掺杂用于电子工业的已切片化学元素等 | Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics. form of | 4 |
| 2 | 848620 | 制造半导体器件或集成电路用的机器及装置 | Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits | 1 |
| # | Partner Name | Country / Region | Records |
|---|---|---|---|
| 1 | ZARA TECH | — | 4 |
| 2 | BESI APAC SDN BHD | MALAYSIA | 1 |
| Date | Aug 14, 2025 | Bill No. | W202025108056089 | ||
|---|---|---|---|---|---|
| Supplier Information | Company Name | AIDEK PTE LTD | Buyer Information | Company Name | BESI APAC SDN BHD |
| Address | 15 YISHUN INDUSTRIAL ST. 1 02-14 WIN 5 SINGAPORE 768091 | Address | NO. 22 24 , JALAN PEMAJU U1/15 , GLENMAI I E HICOM INDUSTRIAL PARK SHAH ALAM 40150 | ||
| Registration No. | — | Registration No. | 206981D | ||
| Phone | — | Phone | — | ||
| — | — | ||||
| Product Information | HS Code | 84862019 | HS Description | 制造半导体器件或集成电路用的机器及装置Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits | |
| Product Description | 8-INCH WAFER DICING | Brand | — | ||
| Quantity & Price | Amount | 372.46 | Weight | — | |
| Quantity | 1 UNT | TEU | — | ||
| Shipment Information | Origin Country | SINGAPORE | Destination Country | MALAYSIA | |
| Port of Loading | SINGAPORE | Destination Port | KUALA LUMPUR | ||
| Loading Place | — | Transport Mode | AIR | ||
| Transaction Mode | — | Carrier | — | ||
| Vessel Name | — | Voyage | — | ||
| Container No. | — | Shipping Country | — | ||