View monthly record counts
| Month | Records |
|---|---|
| 1 |
Data updated:
| Month | Records |
|---|---|
| 1 |
| # | Country / Region | Records |
|---|---|---|
| 1 | Malaysia | 1 |
| # | HS Code | Description (CN) | Description (EN) | Records |
|---|---|---|---|---|
| 1 | 903141 | 制造半导体器件(包括集成电路)时检验半导体晶圆、器件(包括集成电路)或检测光掩模及光栅用的光学仪器及器具 | For inspecting semiconductor wafers or devices (including integrated circuits) or for inspecting photomasks or reticles used in manufacturing semiconductor devices (including integrated circuits) | 1 |
| # | Partner Name | Country / Region | Records |
|---|---|---|---|
| 1 | MI EQUIPMENT M SDN BHD | MALAYSIA | 1 |
| Date | Feb 26, 2025 | Bill No. | — | ||
|---|---|---|---|---|---|
| Supplier Information | Company Name | MI EQUIPMENT M SDN BHD | Buyer Information | Company Name | QUALCOM CDMA TECHNOLOGIES |
| Address | NO 20 BAYAN LEPAS TECHNOPLEX | Address | ASIA-PACIFIC PTE.LTD. | ||
| Registration No. | 1005839H | Registration No. | — | ||
| Phone | — | Phone | — | ||
| — | — | ||||
| Product Information | HS Code | 90314100 | HS Description | 制造半导体器件(包括集成电路)时检验半导体晶圆、器件(包括集成电路)或检测光掩模及光栅用的光学仪器及器具For inspecting semiconductor wafers or devices (including integrated circuits) or for inspecting photomasks or reticles used in manufacturing semiconductor devices (including integrated circuits) | |
| Product Description | AI ENABLED WAFER LEVEL ADVANCED PACKAGING & DIE SORTING MACHINE | Brand | — | ||
| Quantity & Price | Amount | 265,230.78 | Weight | 1,650 kg | |
| Quantity | 1 UNT | TEU | — | ||
| Shipment Information | Origin Country | MALAYSIA | Destination Country | SINGAPORE | |
| Port of Loading | KAMPONG TANJONG KUPANG | Destination Port | SINGAPORE | ||
| Loading Place | — | Transport Mode | ROAD | ||
| Transaction Mode | — | Carrier | — | ||
| Vessel Name | — | Voyage | — | ||
| Container No. | — | Shipping Country | — | ||