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QUALCOM CDMA TECHNOLOGIES

Buyer
SINGAPORE
ASIA-PACIFIC PTE.LTD.

Data updated:

Total Import Trade Records1Total Import Value265.23KTotal Import Weight1,650Import Trading Partners1Import Trade Countries1
Import Trade Trend (Feb 2025)2025-02: 1
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Monthly counts shown in this chart. Not provided means unknown, not zero.
MonthRecords
1

Top 3 Import HS Codes

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#HS CodeDescription (CN)Description (EN)Records
1903141制造半导体器件(包括集成电路)时检验半导体晶圆、器件(包括集成电路)或检测光掩模及光栅用的光学仪器及器具For inspecting semiconductor wafers or devices (including integrated circuits) or for inspecting photomasks or reticles used in manufacturing semiconductor devices (including integrated circuits)1

Top 3 Import Trading Partners

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#Partner NameCountry / RegionRecords
1MI EQUIPMENT M SDN BHDMALAYSIA1

Latest Import Trade Record

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All fields from the latest supplied import record. A dash means the field was not provided; zero is a supplied zero.
DateFeb 26, 2025Bill No.—
Supplier InformationCompany NameMI EQUIPMENT M SDN BHDBuyer InformationCompany NameQUALCOM CDMA TECHNOLOGIES
AddressNO 20 BAYAN LEPAS TECHNOPLEXAddressASIA-PACIFIC PTE.LTD.
Registration No.1005839HRegistration No.—
Phone—Phone—
Email—Email—
Product InformationHS Code90314100HS Description制造半导体器件(包括集成电路)时检验半导体晶圆、器件(包括集成电路)或检测光掩模及光栅用的光学仪器及器具For inspecting semiconductor wafers or devices (including integrated circuits) or for inspecting photomasks or reticles used in manufacturing semiconductor devices (including integrated circuits)
Product DescriptionAI ENABLED WAFER LEVEL ADVANCED PACKAGING & DIE SORTING MACHINEBrand—
Quantity & PriceAmount265,230.78Weight1,650 kg
Quantity1 UNTTEU—
Shipment InformationOrigin CountryMALAYSIADestination CountrySINGAPORE
Port of LoadingKAMPONG TANJONG KUPANGDestination PortSINGAPORE
Loading Place—Transport ModeROAD
Transaction Mode—Carrier—
Vessel Name—Voyage—
Container No.—Shipping Country—