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I ENGINEERING & TECHNOLOGY SDN BHD

Buyer
MALAYSIA
A-1-9 & A-M-9,KOMPLEKS IND PUCHONG,NO 1,JLN TPP 1/6 TMN PERIND PUCHONG,PUCHONG

Data updated:

Total Import Trade Records66Total Import Value39.24KTotal Import Weight973.29Import Trading Partners9Import Trade Countries6
Import Trade Trend (Oct 2025 – May 2026)2025-10: 6; 2025-11: 4; 2025-12: 16; 2026-01: 31; 2026-02: 5; 2026-03: 2; 2026-04: 1; 2026-05: 1
View monthly record counts
Monthly counts shown in this chart. Not provided means unknown, not zero.
MonthRecords
6
4
16
31
5
2
1
1

Top 3 Import HS Codes

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#HS CodeDescription (CN)Description (EN)Records
18479908479所列机器的零件Parts of machines and mechanical appliances, n.e.s.17
2848690品目8486的零件及附件Parts and accessories for machines and apparatus of heading 8486.17
3848620制造半导体器件或集成电路用的机器及装置Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits8

Latest Import Trade Record

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All fields from the latest supplied import record. A dash means the field was not provided; zero is a supplied zero.
DateMay 30, 2026Bill No.—
Supplier InformationCompany NameINFINEON TECHNOLOGIES BATAMBuyer InformationCompany NameI ENGINEERING & TECHNOLOGY SDN BHD
Address—AddressNO .1, JALAN TPP 1/6, TAMAN PERINDUSTRIAN PUCHONG, 47160, PUCHONG, SELANGOR
Registration No.010847101217000Registration No.—
Phone—Phone—
Email—Email—
Product InformationHS Code84864020HS Description本章注释11(3)规定的机器及装置Machines and apparatus specified in Note 11 (C) to this Chapter
Product DescriptionDIE BONDER MACHINE Die attach apparatus, tape automated, wire bonders and encapsulation equipment for the assembly of semiconductorsBrand—
Quantity & PriceAmount23,222.25Weight24.47 kg
Quantity1 SetTEU—
Shipment InformationOrigin CountryINDONESIADestination CountryMALAYSIA
Port of LoadingSEKUPANGDestination PortKUALA LUMPUR
Loading Place—Transport ModeSEA
Transaction Mode—Carrier—
Vessel Name—Voyage—
Container No.—Shipping Country—