View monthly record counts
| Month | Records |
|---|---|
| 1 |
ADVANCED SEMICONDUCTOR ENGINEER
BuyerCHINA MAINLAND
ING (SHANGHAI)INC 421,LI SHI ZHEN ROAD ZHANGJIANG HI-TECH PARK PUDONG NEW AREA 201203 SHANGHAI CHINA
Data updated:
Top 3 Import Trade Countries
View all on Tradesparq| # | Country / Region | Records |
|---|---|---|
| 1 | Malaysia | 1 |
Top 3 Import HS Codes
View all on Tradesparq| # | HS Code | Description (CN) | Description (EN) | Records |
|---|---|---|---|---|
| 1 | 741011 | 无衬背精炼铜箔，厚≤0.15mm | Refined copper foil, not backed, of a thickness of ≤ 0,15 mm | 1 |
Top 3 Import Trading Partners
View all on Tradesparq| # | Partner Name | Country / Region | Records |
|---|---|---|---|
| 1 | MITSUI COPPER FOIL MALAYSIA SDN BHD | MALAYSIA | 1 |
Latest Import Trade Record
View more records on Tradesparq| Date | Jul 29, 2025 | Bill No. | W202025207103111 | ||
|---|---|---|---|---|---|
| Supplier Information | Company Name | MITSUI COPPER FOIL MALAYSIA SDN BHD | Buyer Information | Company Name | ADVANCED SEMICONDUCTOR ENGINEER |
| Address | NO.1C, PERSIARAN KUALA LANGAT, SEKSYEN 27, 40400 SHAH ALAM,SELANGOR. | Address | ING (SHANGHAI)INC 421,LI SHI ZHEN ROAD ZHANGJIANG HI-TECH PARK PUDONG NEW AREA 201203 SHANGHAI CHINA | ||
| Registration No. | — | Registration No. | — | ||
| Phone | — | Phone | — | ||
| — | — | ||||
| Product Information | HS Code | 74101190 | HS Description | 无衬背精炼铜箔，厚≤0.15mmRefined copper foil, not backed, of a thickness of ≤ 0,15 mm | |
| Product Description | COPPER FOIL WITHOUT ADHESIVECOATING | Brand | — | ||
| Quantity & Price | Amount | 2,198.20 | Weight | 41 kg | |
| Quantity | 41 KGM | TEU | — | ||
| Shipment Information | Origin Country | MALAYSIA | Destination Country | CHINA | |
| Port of Loading | KUALA LUMPUR | Destination Port | SHANGHAI PUDONG INTERNATIONAL APT | ||
| Loading Place | — | Transport Mode | AIR | ||
| Transaction Mode | — | Carrier | — | ||
| Vessel Name | — | Voyage | — | ||
| Container No. | — | Shipping Country | — | ||